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2023-10-08 09:44:59
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Broadcom Launches Next-Generation Low-Power AI Chip to Support High-Speed Optical Networks
1. Broadcom unveiled the 5nm 200G/channel PAM chip BCM858222 at ECOC 2023, which integrates a laser driver with leading PAM-4 modulation performance. 2. The BCM85822 enables a switching capacity of 51.2T, enhancing data center network density. 3. The new chip helps achieve the goal of 200G for both electrical and optical links. 4. The BCM85822 facilitates the migration of AI workloads from 800G to 1.6T.